Sensylink’s sensing field technology optimized for use with Snapdragon Wear Elite Platform to help enable Wearable Intelligence

Sensylink recently has announced that it is working with Qualcomm Technologies to enable micro-miniaturized high-precision temperature on their Snapdragon Wear™ Elite Platform. This comes as the industry is working on enabling sensing field over a new generation of smart wearable devices that can better understand user needs, provide proactive services, and offer highly personalized experiences.

Sensylink’ s sensor family has launched the new generation ultra-high precision digital temperature sensor CT7117 This product with its breakthrough precision, extreme miniaturization form-factor and outstanding reliability, provide the key physiological and environmental sensing capabilities for devices based on the new generation Snapdragon Wear Elite Platform, contributing to the creation of a smarter and more reliable personalized healthcare experience.

Defining a new standard of precision: CT7117 digital temperature sensor
CT7117 is a milestone product in Sensylink’s micro-miniaturized high-precision temperature sensing field. It is specifically designed for wearable and portable devices with extreme requirements for space and precision, and has significant core advantages:

• Clinical-grade temperature measurement accuracy: Within the critical physiological temperature range of 20°C to 50°C, its temperature measurement accuracy is as high as ±0.1°C (maximum). This outstanding performance enables it to meet the strict requirements for data accuracy in high-end health applications such as continuous body temperature monitoring, female healthcare management and fever warning, providing a reliable data foundation for algorithm models.

• Extreme miniaturization design: The chip size is only 0.73mm x 0.73mm, making it one of the smallest temperature sensors in the market at the same precision level. Its ultra-small footprint frees up valuable space for internal device design, especially suitable for extremely compact product forms such as smartwatches, TWS, smart rings, and skin patches.
• Seamless compatibility with advanced platforms: The chip supports operating voltages from a minimum of 1.4V to a maximum of 5.5V., enabling efficient and low-power communication with new-generation low-power wearable platforms such as Snapdragon Wear Elite, simplifying system design.

In addition, based on the CT7117 platform, Sensylink has launched upgraded variants with enhanced performance across key parameters. These versions support a lower 1.2V I/O level for improved low-power compatibility, deliver higher accuracy of up to ±0.08°C (max) over 20°C–50°C, and feature strengthened packaging reliability to improve mass production yield. Support for the I3C interface further enables faster, more power-efficient communication and simplified system integration.

Sensylink Chairman & CEO Peter Wang stated, "We firmly believe that the future of smart wearables lies in 'perceiving, understanding, and anticipating user needs.' The two sensors we have released this time are highly consistent with Qualcomm Technologies' drive of high performance, low power consumption, and strong AI processing capabilities. Precise sensor data is the foundation of the next generation of proactive, personalized health services. We are committed to driving innovation at the chip level to help our customers create smart wearables that better understand and are more trustworthy to users."

This collaboration is not only an upgrade in hardware but also the core driving force for the transformation of Sensylink products towards proactive and contextualized intelligent services. Sensylink looks forward to working with Qualcomm Technologies to further drive the development of the smart wearable industry towards greater intelligence, specialization, and personalization.

About Sensylink
Sensylink Microelectronics Inc. is a high-performance IC design company focusing on sensor chips and mixed-signal chips. Our products cover multiple categories such as thermal management ICs, temperature & humidity sensors, ADCs, digital interfaces and security ICs. These products feature high precision, small size, low power consumption and can be widely used in wearable devices, industrial, communication and consumer electronics market segments.

Snapdragon branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Snapdragon and Snapdragon Wear are trademarks or registered trademarks of Qualcomm Incorporated.

Company Contact：

chenhuan@sensylink.com

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